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化学镀铜

网络Electroless Plating Copper; PTH; Electroless Copper Plating

化学镀铜

网络释义

化学镀铜

Electroless Plating Copper

化学镀铜(Electroless Plating Copper)俗称沉铜。印制电路板孔金属化技术是印制电路板制造技术的关键之一。

PTH

化学镀铜（PTH） Chapter 1 沉铜原理(Shipley) 一概述带格式的: 缩进: 首行缩进: 0.9 格式的字符带格式的: 缩进: 首行缩进: 0.…

Electroless Copper Plating

脑化学的翻译结果 -... ... Radioanalytical Chemistry 放射分析化学 Electroless Copper Plating 化学镀铜 brain 脑 ...

electroless copper

化学镀铜,el... ... ) electroless copper plating 化学镀铜 ) electroless copper 化学镀铜 ) chemical copper plating 化学镀铜 ...

Eletcroless Plating Copper

PCB 化学镀铜(Eletcroless Plating Copper)通常也叫沉铜或孔化（PTH）是一种自身催化性氧化还原反应。首先用活化剂处理…

chemical copper plating

化学镀铜,el... ... ) electroless copper 化学镀铜 ) chemical copper plating 化学镀铜 ) electroless plating copper 化学镀铜 ...

electroless Cu plating

化学浸镀铜,Imme... ... ) electroless copper 化学镀铜 ) electroless Cu plating 化学镀铜 ) chemical copper plating 化学镀铜 ...

例句：

Theoretical analysis and numerical simulation methods for the electroless copper deposition is presented in this paper .

本文采用理论分析和数值模拟的方法模拟化学镀铜的沉积过程。

The effect of maleic acid, potassium ferrocyanide and thiourea on electroless copper plating was investigated .

研究了马来酸、亚铁氰化钾和硫脲对化学镀铜的影响。

A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.

研制了一种新型的钢铁基件酸性化学镀铜工艺技术。

After passive treatment, the rustproof ability of kinds of coppered welding wires has been improved obviously .

电镀和化学镀铜焊丝经钝化后抗蚀性能均有明显提高。

The influence of weight increase rate of the chemical brass -plated polyester knitted fabric on its electromagnetic shielding properties

增重率对化学镀铜涤纶针织物防电磁波性能的影响

Environmentally Friendly Non-Formaldehyde PTH Darkness Preliminary Investigation

环保型非甲醛化学镀铜发黑问题初探

Influence of surfactants and polar organics on absorption spectrum and deposition rate of chemical copper plating solution

表面活性剂与极性有机物对化学镀铜的影响

An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating

络合剂和添加剂对化学镀铜影响的电化学研究

The application of a new technology of chemical plating Cu to electronic industry

化学镀铜新工艺及其在电子工业中的应用

Copper Electroless Plating on the Surface of Magnetic Fly-ash Powder

粉煤灰磁粉表面化学镀铜的研究

Condition Study of Electroless Copper Plating for Nitrocellulose

硝基纤维素片化学镀铜工艺研究

Comprehensive Utilization and Treatment of Chemical Copper Plating Effluent

化学镀铜废液的综合利用和处理

Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation

陶瓷表面无敏化活化法微细化学镀铜

Research of Electroplating Cu on Pretreatment Ceramic Substrates

陶瓷基板化学镀铜预处理的研究

Electrochemical Study on Electroless Copper Plating Using Sodium Hypophosphite as Reductant

以次磷酸钠为还原剂化学镀铜的电化学研究

An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent

乙醛酸化学镀铜的电化学研究

Process Control of Automatic Production Line of Copper Electroless Plating on Printed Circuit Board

印刷电路板化学镀铜自动线的工艺管理

Electroless Copper Plating on Graphite Surface without Activation and Sensitization

石墨表面无敏化及活化的化学镀铜法

The Solution Study of Electroless Copper Plating Using Nontoxic Glyoxylic Acid as Reducing Agent

环保型乙醛酸为还原剂的化学镀铜液的研究进展

Electroless Copper Deposition Using Sodium Hypophosphite as Reductant

以次磷酸钠为还原剂的化学镀铜

Continuous Determination of Copper and Formaldehyde in Copper Electroless Plating Bath

化学镀铜液中铜及甲醛的连续测定

Principle, application and research prospect of electroless copper plating

化学镀铜原理、应用及研究展望

Study on the Technology of the Electroless Copper Plating on the Stainless Steel Substrate

不锈钢基体上化学镀铜工艺研究

Preparation of Copper Composites by Electroless Plating and Their Wear Performance

固体颗粒增强化学镀铜基复合材料及其磨损研究

Laser-Induced Selective Electroless Plating of Copper on Semiconductor Silicon

半导体硅上激光诱导选择性化学镀铜

化学镀铜

化学镀铜

Electroless Plating Copper

PTH

Electroless Copper Plating

electroless copper

Eletcroless Plating Copper

chemical copper plating

electroless Cu plating

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